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MTHPA-Based High-Temperature Anhydride-Cured Epoxy Resin
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MTHPA-Based High-Temperature Anhydride-Cured Epoxy Resin

MTHPA-Based High-Temperature Anhydride-Cured Epoxy Resin

Application of High-Temperature Curing Epoxy Systems in Industrial Composites
MTHPA Epoxy Solutions for Enhanced High-Temperature Performance of Structural Components
High-Temperature Curing Epoxy Systems – Combining Strength and Reliability
High-Temperature Curing Epoxy Systems for Electrical Equipment and Composites
High-Performance Epoxy Curing Agents for Extreme Temperature Applications

Description

MTHPA-Based High-Temperature Anhydride-Cured Epoxy Resin

 

Product Overview

 

Our High-Temperature Anhydride-Cured Epoxy Resin is specially formulated for electrical, electronic, and composite applications that require exceptional heat resistance, mechanical stability, and long-term reliability.
Using advanced acid anhydride curing agents (such as MTHPA, HHPA, and THPA), this resin system provides superior thermal endurance, low shrinkage, and excellent insulation performance - ideal for encapsulation, casting, and structural bonding under high-temperature conditions.

 

Key Features

 

  • Superior Thermal Resistance: Continuous operation at 180–200°C (Class H–N), excellent dimensional stability under heat.
  • High Mechanical Strength: Outstanding tensile and flexural strength under high-temperature stress.
  • Low Shrinkage & Low Exotherm: Ensures crack-free curing for precision components.
  • Excellent Electrical Insulation: Maintains dielectric strength ≥15 kV/mm under elevated temperatures.
  • Chemical & Moisture Resistance: Reliable under humidity, oil, and chemical exposure.
  • Environmentally Friendly: Low-toxicity, REACH & RoHS compliant.

 

Applications

 

  1. High-temperature electrical insulation
  2. Motors, generators, and inverters
  3. Power transformers and cast resin systems
  4. Composite structural bonding and laminates
  5. Electronic encapsulation and high-heat PCB protection

 

Technical Specifications

 

  • Property: Typical Value
  • Thermal Class: H (180°C) – N (200°C)
  • Dielectric Strength: ≥15 kV/mm
  • Volume Resistivity: ≥10¹⁴ Ω·cm
  • Viscosity (25°C): 1500–2500 mPa·s
  • Gel Time (120°C): 20–30 min
  • Density: 1.18–1.25 g/cm³
  • Curing Agent: MTHPA / HHPA / THPA
  • Mixing Ratio (Resin:Curing Agent): 100:90–100

 

Why Choose Us

 

  1. Expert in Anhydride Curing Chemistry - Over 15 years of experience in MTHPA/HHPA/THPA systems.
  2. Reliable High-Temperature Performance - Proven stability in 180–200°C applications.
  3. Global Supply Capability - 80,000+ tons annual capacity with consistent quality control.
  4. Custom Formulation Services - Tailored viscosity, reactivity, and curing profile for specific processes.
  5. Eco-Friendly Production - Compliant with ISO 9001, ISO 14001, and international safety standards.

 

Packaging & Delivery

 

  • 25 kg / 200 kg steel drums or 1000 kg IBC
  • Standard export packaging with labeling and palletizing
  • Global delivery by sea or air
  • Technical and application support available worldwide

 

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