High Purity Bisphenol A Epoxy Resin
Integration of research, synthesis, and manufacturing of liquid epoxy resins and matching anhydride curing agents ensures batch-traceable technical documentation and tailored grade options to support industrial formulation development and commercial manufacturing.
Description
Product Name: High Purity Bisphenol A Epoxy Resin
Chemical Type: Diglycidyl Ether of Bisphenol A (DGEBA)
Physical Form: Clear to light-colored liquid at room temperature
Function: Thermosetting base polymer designed for reaction with compatible curing agents (such as acid anhydrides and amines) to form cross-linked industrial systems.
Integration of research, synthesis, and manufacturing of liquid epoxy resins and matching anhydride curing agents ensures batch-traceable technical documentation and tailored grade options to support industrial formulation development and commercial manufacturing.
Technical Specifications & Analytical Parameters
|
Parameter |
Test Method / Reference |
Engineering Significance |
|
Epoxy Equivalent Weight (EEW) |
ASTM D1652 |
Defines the mass of resin containing one gram-equivalent of epoxy groups; required for calculating stoichiometric curing-agent ratios. |
|
Viscosity at 25°C |
ASTM D445 / ISO 3219 |
Governs fluid behavior during meter-mix dispensing, vacuum degassing, and fiber impregnation. |
|
Hydrolyzable Chlorine |
ASTM D1726 |
Critical indicator for electronic and electrical insulation; lower levels mitigate ionic corrosion risks. |
|
Inorganic Chloride |
Potentiometric Titration |
Monitors ionic contamination levels for sensitive electrical encapsulation. |
|
Color (APHA / Gardner) |
ASTM D1209 |
Ensures aesthetic consistency and clarity for transparent coatings and optical castings. |
|
Moisture Content |
Karl Fischer (ASTM E203) |
Controls against void formation and interfacial adhesion failure during thermal cure cycles. |
|
Volatile Content |
Mass Loss Determination |
Affects high-temperature processing stability and minimizes outgassing during vacuum casting. |
Target Industrial Applications
Electrical Insulation & Castings: Utilized in transformers, switchgear, and insulators when formulated with compatible anhydride curing agents. Focuses on low exotherm during bulk casting and stable dielectric performance.
Electronic Potting & Encapsulation: Deployed for protecting microelectronic assemblies and sensors. Controlled ionic profiles and low fluid viscosity support defect-free penetration around delicate wire bonds.
Industrial Coatings & Adhesives: Acts as the binder backbone for anti-corrosion primers, heavy-duty floor coatings, and structural adhesives, delivering robust chemical resistance upon full cross-linking.
Advanced Composites: Applied in filament winding, pultrusion, and resin transfer molding (RTM). Offers uniform wetting of glass, carbon, and aramid fibers to optimize interfacial shear strength.
Regulatory & Compliance Status
REACH Compliance: Managed for EU market access and chemical registration requirements.
RoHS & Heavy Metal Constraints: Formulated to meet standard restrictions on hazardous substances for electrical and electronic applications.
Documentation Support: Full provision of Safety Data Sheets (SDS) and regulatory statements upon request.
Packaging, Storage & Logistics
Standard Packaging:
Lined steel drums (200 kg net weight), Intermediate Bulk Containers (IBC / 1000 kg net weight), or customized options.
Storage Recommendations:
Store in tightly closed containers in a cool, dry, well-ventilated area away from direct sunlight. Recommended storage temperature: 15°C to 35°C.
Shelf Life:
Typically 12 to 24 months from the date of manufacture under unopened, recommended storage conditions.
Global Export Support:
Comprehensive export documentation provided for ocean and air logistics, covering customs clearance and dangerous goods management.
Frequently Asked Questions
Q: What distinguishes a high purity bisphenol A epoxy resin from standard commercial grades?
A: High purity grades feature tighter molecular weight distribution limits, minimized hydrolyzable and ionic chlorine content, lower moisture levels, and superior color stability, reducing electrical failure risks in sensitive formulations.
Q: Can this resin be cured with acid anhydride curing agents?
A: Yes. DGEBA epoxy resins are widely paired with liquid or solid anhydride curing agents alongside appropriate accelerators for high-temperature electrical and mechanical applications.
Q: How can I obtain a sample for laboratory evaluation?
A: Contact the technical sales team with your company details, target application, and project scale to arrange for test quantities accompanied by the corresponding TDS and COA.
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